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Nvidia Jetson Agx Orin Developer Kit

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Nvidia Jetson Agx Orin Developer Kit

Original price was: ₹249,999.00.Current price is: ₹219,999.00. (Inc. All Taxes And With GST Input Credit)

he NVIDIA® Jetson AGX Orin™ Developer Kit includes a high-performance, power-efficient Jetson AGX Orin module, and can emulate the other Jetson Orin modules. You now have up to 275 TOPS and 8X the performance of NVIDIA® Jetson AGX Xavier™ in the same compact form-factor for developing advanced robots and other autonomous machine products.

Supported by NVIDIA JetPack™ and use-case specific software platforms including Isaac for robotics, and Metropolis for smart cities, this developer kit provides everything you need to get started right away.

  • SKU:
  • 945-13730-0007-000

Jetson AGX Orin Developer Kit Specifications

JETSON AGX ORIN MODULE
AI Performance 275 TOPs
GPU NVIDIA Ampere architecture with 2048 NVIDIA® CUDA® cores and 64 tensor cores
CPU 12-core Arm Cortex-A78AE v8.2 64-bit CPU
3MB L2 + 6MB L3
DL Accelerator 2x NVDLA v2.0
Vision Accelerator PVA v2.0
Memory 32GB 256-bit LPDDR5
204.8 GB/s
Storage 64GB eMMC 5.1
Video Encode 2x 4K60 | 4x 4K30 | 8x 1080p60 | 16x 1080p30 (H.265)
Video Decode 1x 8K30 | 3x 4K60 | 7x 4K30 | 11x 1080p60 | 22x 1080p30 (H.265)

Refer to the Software Features section of the latest NVIDIA Jetson Linux Developer Guide for a list of supported features

REFERENCE CARRIER BOARD
Camera 16 lane MIPI CSI-2 connector
PCIe x16 PCIe slot:
Lower x8 PCIe Gen4
RJ45 Up to 10 GbE
M.2 Key M x4 PCIe Gen 4
M.2 Key E x1 PCIe Gen 4, USB 2.0, UART, I2S
USB Type-C 2x USB 3.2 Gen2 with USB-PD support
USB Type-A 2x USB 3.2 Gen2
2x USB 3.2 Gen1
USB Micro-B USB 2.0
DisplayPort DisplayPort 1.4a (+MST)
microSD slot UHS-1 cards up to SDR104 mode
Other 40-pin header (I2C, GPIO, SPI, CAN, I2S, UART, DMIC)
12-pin automation header
10-pin audio panel header
10-pin JTAG header
4-pin fan header
2-pin RTC battery backup connector
DC power jack
Power, Force Recovery, and Reset buttons
Dimensions 110mm x 110mm x 71.65mm
(Height includes feet, carrier board, module, and thermal solution)

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